© 2007 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSUSB45 • Rev. 1.0.7

9

Physical Dimensions

Figure 17. 10-Lead Ultrathin Molded Leadless Package (UMLP)

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the te

rms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/dwg/UM/UMLP10A.pdf.

A

B

C

SEATING

PLANE

DETAIL A

PIN#1 IDENT

RECOMMENDED

LAND PATTERN

NOTES:

A. PACKAGE DOES NOT CONFORM TO

ANY JEDEC STANDARD.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. LAND PATTERN RECOMMENDATION IS

BASED ON FSC DESIGN ONLY.

E. DRAWING FILENAME: MKT-UMLP10Arev5.

F. FAIRCHILD SEMICONDUCTOR.

TOP VIEW

BOTTOM VIEW

0.10 C

0.08 C

0.10 C

2X

2X

SIDE VIEW

0.10 C

0.05

0.00

3

6

1

0.10 C A B

0.05 C

0.55 MAX.

10

1.40

1.80

0.40

0.15

0.25

(10X)

0.35

0.45

(9X)

1.70

2.10

0.40

0.663

0.563

(9X)

0.225

(10X)

1

(0.15)

0.55

0.45

DETAIL A

SCALE : 2X

1.85

1.45

0.55

0.40

0.225

(10X)

9X

0.45

PIN#1 IDENT

OPTIONAL MINIMIAL

TOE LAND PATTERN

SCALE : 2X

LEAD

OPTION 1

SCALE : 2X

LEAD

OPTION 2

PACKAGE

EDGE

45°

0.25

0.15