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ESDS312DBVR 데이터시트(PDF) 11 Page - Texas Instruments |
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ESDS312DBVR 데이터시트(HTML) 11 Page - Texas Instruments |
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11 / 21 page ![]() 11 ESDS312, ESDS314 www.ti.com SLVSEG9B – MAY 2018 – REVISED SEPTEMBER 2018 Product Folder Links: ESDS312 ESDS314 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated 9 Power Supply Recommendations The ESDS314, ESDS312 devices are passive ESD devices and there is no need to power it. Take care not to violate the recommended I/O specification (0 V to 3.6 V) to ensure the device functions properly. 10 Layout 10.1 Layout Guidelines • The optimum placement is as close to the connector as possible. – EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces, resulting in early system failures. – The PCB designer must minimize the possibility of EMI coupling by keeping any unprotected traces away from the protected traces which are between the TVS and the connector. • Route the protected traces as straight as possible. • Eliminate any sharp corners on the protected traces between the TVS and the connector by using rounded corners with the largest radii possible. – Electric fields tend to build up on corners, increasing EMI coupling. 10.2 Layout Example Figure 15. Layout Example for 4-channel Device |
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