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SN74LVC2G53

SCES324P – JULY 2001 – REVISED OCTOBER 2016

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Copyright © 2001–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(4)

This value is limited to 5.5 V maximum.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.5

6.5

V

–0.5

6.5

V

–0.5

V

Control input clamp current

–50

mA

I/O port diode current

±50

mA

ON-state switch current

±50

mA

±100

mA

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±2000

V

±1000

(1)

CMOS Inputs, SCBA004.

6.3 Recommended Operating Conditions

See note

MIN

MAX

UNIT

Supply voltage

1.65

5.5

V

I/O port voltage

0

V

High-level input voltage, control input

V

Low-level input voltage, control input

V

Control input voltage

0

5.5

V

Δt/Δv

Input transition rise and fall time

20

ns/V

20

10

10

Operating free-air temperature

–40

85

°C