8

■Temperature Profile

Applicable Conditions

Reflow System : Far-infrared, hot-air reflow

Reflow chamber atmosphere : Air

Solder

: Paste type Sn/3.0 Ag/0.5 Cu

(M705-GRN360-K2-V;

Senju Metal Industry Co., Ltd.)

Test PCB

: PCB material and size

Glass epoxy 25 × 50 × 0.8 mm

Land dimensions

0.3 × 0.65, 0.3 × 0.8 mm

Metal Mask

: Thickness : 0.1 mm

Opening dimension

0.23 × 0.55, 0.23 × 0.65 mm

The provided temperature profile shown is based on the

conditions described above.

Variations may occur due to the changing conditions such

as solder paste types, different manufacturers, PCB size,

and other soldering materials. Please check the mounting

conditions before use.