Data Sheet

HMC856

Rev. D | Page 13 of 13

OUTLINE DIMENSIONS

16

0.50

BSC

0.40

BSC

3.50 REF

BOTTOM VIEW

TOP VIEW

SIDE VIEW

1.12 MAX

3.50 SQ

1

32

9

17

24

25

8

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.36

0.30

0.24

PIN 1

(0.32 × 0.32)

EXPOSED

PAD

PIN 1

INDICATOR

5.13

5.00 SQ

4.87

SEATING

PLANE

Figure 26. 32-Terminal Ceramic Leadless Chip Carrier [LCC]

(HE-32-1)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature

Range

Moisture Sensitivity

Package Description

Package

Option

HMC856LC5

−40°C to +85°C

MSL3

32-Terminal Ceramic Leadless Chip Carrier [LCC]

HE-32-1

HMC856LC5TR

−40°C to +85°C

MSL3

32-Terminal Ceramic Leadless Chip Carrier [LCC]

HE-32-1

HMC856LC5TR-R5

−40°C to +85°C

MSL3

32-Terminal Ceramic Leadless Chip Carrier [LCC]

HE-32-1

127102-

HMC856LC5

Evaluation Board

1

All models are RoHS compliant parts.

2

See the Absolute Maximum Ratings section.

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registered trademarks are the property of their respective owners.

D14720-0-6/18(D)