| 전자부품 데이터시트 검색엔진 |
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LM3501 데이터시트(PDF) 15 Page - National Semiconductor (TI) |
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LM3501 데이터시트(HTML) 15 Page - National Semiconductor (TI) |
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15 / 18 page ![]() Application Information (Continued) to minimize copper trace connections that can inject noise into the system. The ground connection for the current set- ting resistor should connect directly to the GND pin. The AGND pin should connect directly to the GND pin. Not connecting the AGND pin directly, as close to the chip as possible, may affect the performance of the LM3501 and limit its current driving capability. Trace connections made to the inductor should be minimized to reduce power dissipa- tion, EMI radiation and increase overall efficiency. It is good practice to keep the V SW routing away from sensitive pins such as the FB pin. Failure to do so may inject noise into the FB pin and affect the regulation of the device. See Figure 3 and Figure 4 for an example of a good layout as used for the LM3501 evaluation board. 20065384 FIGURE 3. Evaluation Board Layout (2X Magnification) Top Layer 20065385 FIGURE 4. Evaluation Board Layout (2X Magnification) Bottom Layer (as viewed from the top) www.national.com 15 |
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