November 22, 2004

33

Philips Semiconductors

Preliminary specification

Universal LCD driver

for low multiplex rates

PCF8562

14.4

Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron

applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300

°C.

When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between

270 and 320

°C.

14.5

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1.

For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy

from your Philips Semiconductors sales office.

2.

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

3.

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

4.

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5.

Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6.

Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE(1)

SOLDERING METHOD

WAVE

REFLOW(2)

BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, HVQFN, HVSON, SMS

not suitable(3)

suitable

PLCC(4), SO, SOJ

suitable

suitable

LQFP, QFP, TQFP

not recommended(4)(5)

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended(6)

suitable