CPC1465

14

www.ixysic.com

R05

3.5.2 CPC1465M 16-Pin DFN Package

NOTE: As the metallic pad on the bottom of the DFN package is connected to the substrate of the die, IXYS

Integrated Circuits recommends that no printed circuit board traces or vias be placed under this area.

DIMENSIONS

mm

(inches)

5.80

(0.228)

0.35

(0.014)

1.05

(0.041)

0.80

(0.031)

EXPOSED

METALLIC PAD

7.00 ± 0.25

(0.276 ± 0.01)

6.00 ± 0.25

(0.236 ± 0.01)

INDEX AREA

TOP VIEW

SEATING

PLANE

SIDE VIEW

0.90 ± 0.10

(0.035 ± 0.004)

0.30 ± 0.05

(0.012 ± 0.002)

0.02, + 0.03, - 0.02

(0.0008, + 0.0012, - 0.0008)

0.20

(0.008)

4.25 ± 0.05

(0.167 ± 0.002)

0.55 ± 0.10

(0.022 ± 0.004)

6.00 ± 0.05

(0.236 ± 0.002)

BOTTOM VIEW

Dimensions

mm

(inch)

Terminal Tip

Pin 16

Pin 1

0.80

(0.032)