CPC1466D datasheet(13/14 Pages) IXYS

13 / 14 page

INTEGRATED CIRCUITS DIVISION

R03

www.ixysic.com

CPC1466

3.5 Mechanical Dimensions

3.5.1 CPC1466M 16-Pin DFN Package

3.5.2 CPC1466MTR 16-Pin DFN Tape & Reel

EXPOSED

METALLIC PAD

7.00 ± 0.25

(0.276 ± 0.01)

6.00 ± 0.25

(0.236 ± 0.01)

INDEX AREA

TOP VIEW

SEATING

PLANE

SIDE VIEW

0.90 ± 0.10

(0.035 ± 0.004)

0.30 ± 0.05

(0.012 ± 0.002)

0.02, + 0.03, - 0.02

(0.0008, + 0.0012, - 0.0008)

0.20

(0.008)

4.25 ± 0.05

(0.167 ± 0.002)

0.55 ± 0.10

(0.022 ± 0.004)

6.00 ± 0.05

(0.236 ± 0.002)

BOTTOM VIEW

Dimensions

(inch)

Terminal Tip

Pin 16

Pin 1

0.80

(0.032)

DIMENSIONS

(inches)

5.80

(0.228)

0.35

(0.014)

1.05

(0.041)

0.80

(0.031)

Recommended PCB Land Pattern

NOTE: Because the metallic pad on

the bottom of the DFN package is

connected to the substrate of the die, it

is recommended that no printed circuit

board traces or vias be placed under

this area.

0=1.61 ± 0.10

(0.063 ± 0.004)

0=6.24 ± 0.10

(0.246 ± 0.004)

0=7.24 ± 0.10

(0.285 ± 0.004)

P1=12.00 ± 0.10

(0.472 ± 0.004)

W=16.00 ± 0.30

(0.630 ± 0.012)

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

DIMENSIONS

(inches)

Direction of feed

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