MP6537 datasheet(3/14 Pages) MPS

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MP6537 – 100V, THREE-PHASE, BLDC MOTOR PRE-DRIVER WITH PWM & ENABLE INPUTS

MP6537 Rev. 1.01

www.MonolithicPower.com

4/20/2018

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ABSOLUTE MAXIMUM RATINGS

(1)

Input voltage (VIN) ........................ -0.3V to 110V

Input voltage VREG, GLA/B/C .... -0.3V to 14.5V

LDO ............................................ -0.3V to 14.5V

BSTA/B/C .................................... -0.3V to 120V

GHA/B/C.................... -0.3V to (BST-SH) + 0.3V

GHA/B/C (transient, 2µs) ...................................

..................................... -8V to (BST-SH) + 0.3V

LSS.................................................. -0.3V to 4V

LSS (transient, 2µs) ............................ -1V to 4V

SHA/B/C ......................................... -5V to 110V

SHA/B/C (transient, 2µs)................. -8V to 110V

All other pins to GND .................... -0.3V to 6.5V

Continuous power dissipation (TA = +25°C)

(2)

QFN-28 (4mmx5mm) .................................3.1W

Storage temperature................ -55°C to +150°C

Junction temperature ............................. +150°C

Lead temperature (solder) ..................... +260°C

Recommended Operating Conditions

(3)

Input voltage (VIN) .......................... +8V to 100V

Input voltage (VREG) ...................... +8.5V to 14V

OCREF voltage (VOC) ................ 0.125V to 2.4V

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance

(4)

θJA

θJC

QFN-28 (4mmx5mm) ............ 40........ 9 .... °C/W

NOTES:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation produces an excessive die temperature, causing

the regulator to go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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