© 2005 Fairchild Semiconductor Corporation

DS005365

www.fairchildsemi.com

February 1984

Revised May 2005

MM74HCT240 • MM74HCT244

Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer

General Description

The MM74HCT240 and MM74HCT244 3-STATE buffers

utilize advanced silicon-gate CMOS technology and are

general purpose high speed inverting and non-inverting

buffers. They possess high drive current outputs which

enable high speed operation even when driving large bus

capacitances. These circuits achieve speeds comparable

to low power Schottky devices, while retaining the low

power consumption of CMOS. All three devices are TTL

input compatible and have a fanout of 15 LS-TTL equiva-

lent inputs.

MM74HCT devices are intended to interface between TTL

and NMOS components and standard CMOS devices.

These parts are also plug-in replacements for LS-TTL

devices and can be used to reduce power consumption in

existing designs.

The

MM74HCT240

is

an

inverting

buffer

and

the

MM74HCT244 is a non-inverting buffer. Each device has

two active low enables (1G and 2G), and each enable inde-

pendently controls 4 buffers.

All inputs are protected from damage due to static dis-

Features

■ TTL input compatible

■ Typical propagation delay: 14 ns

■ 3-STATE outputs for connection to system buses

■ Low quiescent current: 80

PA

■ High output drive current: 6 mA (min)

Ordering Code:

Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

Connection Diagrams

Pin Assignments for DIP, SOIC, SOP and TSSOP

Top View

MM74HCT240

Top View

MM74HCT244

Order Number

Package Number

Package Description

MM74HCT240WM

M20B

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

MM74HCT240SJ

M20D

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

MM74HCT240MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

MM74HCT240N

N20A

20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide

MM74HCT244WM

M20B

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

MM74HCT244SJ

M20D

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

MM74HCT244MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

MM74HCT244N

N20A

20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide