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US2236108DBG-S08-R 데이터시트(PDF) 4 Page - Unisonic Technologies

부품명 US2236108DBG-S08-R
상세설명  ULTRA SMALL, LOW INPUT VOLTAGE, LOW RON LOAD SWITCH
PDF  5 Pages
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제조업체  UTC [Unisonic Technologies]
홈페이지  http://www.utc-ic.com
Logo UTC - Unisonic Technologies

US2236108DBG-S08-R 데이터시트(HTML) 4 Page - Unisonic Technologies

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US2236108DB
Preliminary
LINEAR INTEGRATED CIRCUIT
UNISONICTECHNOLOGIESCO.,LTD
4 of 5
www.unisonic.com.tw
QW-R129-031.b
APPLICATION INFORMATION
ON/OFF Control
The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state so long as
there is no fault. ON is active HI and has a low threshold making it capable of interfacing with low voltage signals.
The ON pin is compatible with standard GPIO logic threshold. It can be used with any microcontroller with 1.2V, 1.8V,
2.5V or 3.3V GPIOs.
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic
capacitor, CIN, place close to the pins is usually sufficient. Higher values of CIN can be use to further reduce the
voltage drop during high current application. When switching heavy loads, it is recommended to have an input
capacitor about 10 times higher than the output capacitor, this in order to avoid excessive voltage drop.
Output Capacitor
Due to the integral body diode in the PMOS switch, a CIN greater than CL is highly recommended. A CL greater
than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through
the body diode from VOUT to VIN.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on
normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical
effects along with minimizing the case-to-ambient thermal impedance.



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