Rev - 040517

BGA Heat Sink - High Performance

maxiFLOW/superGRIP

*Image above is for illustration purpose only.

ATS Part#:

ATS-X50170G-C1-R0

Description:

17.00 x 17.00 x 12.50 mm BGA Heat Sink - High

Performance maxiFLOW/superGRIP

Heat Sink Type:

maxiFLOW

Heat Sink Attachment:

superGRIP

Equivalent Part Number:

N/A

Features & Benefits

Designed for 17x 17 mm components

Requires minimal space around the component’s perimeter; ideal for densely populated PCBs

Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a

PCB may need to be reworked

Strong, uniform attachment force helps achieve maximum performance from phase-changing TIMs

Eliminates the need to drill mounting holes in the PCB

Thermal Performance

AIR VELOCITY

@200 LFM

1.0 M/S

@300 LFM

1.5 M/S

@400 LFM

2.0 M/S

@500 LFM

2.5 M/S

@600 LFM

3.0 M/S

@700 LFM

3.5 M/S

@800 LFM

4.0 M/S

THERMAL RESISTANCE

Unducted Flow

11.1 °C/W

9.1 °C/W

7.9 °C/W

7.1 °C/W

6.5 °C/W

6 °C/W

5.7 °C/W

Ducted Flow

9

N/A

N/A

N/A

N/A

N/A

N/A

Product Detail

Schematic Image

Dimension A

Dimension B

Dimension C

Dimension D

TIM

Finish

*Image above is for illustration purpose only.

17.00 mm

17.00 mm

12.50 mm

31.9 mm

T766

BLUE-ANODIZED

Notes:

Thermal performance data are provided for reference only. Actual performance may vary by

application.

ATS reserves the right to update or change its products without notice to improve the design or

performance.

ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant.

Contact ATS to learn about custom options available.

For more information, to find a distributor or to place an order, please contact us at

781-769-2800 (North America), sales@qats.com or www.qats.com.