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DVRFD615X2 데이터시트(PDF) 1 Page - IXYS Corporation |
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DVRFD615X2 데이터시트(HTML) 1 Page - IXYS Corporation |
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1 / 4 page ![]() DVRFD615X2 Development Board General Description The DVRFD615X2 development board is a general- purpose circuit board designed to simplify the evalu- ation of the IXRFD615X2 gate driver and provide a building block for power circuit development. The IXRFD615X2 gate driver is factory installed on the evaluation board and is fully tested. The DVRFD615X2 150/275 configuration enables the user to drive DE150- or DE275-sized MOSFETs with their lower drive requirements. The board de- sign allows both the driver and MOSFETs to be at- tached to a heat sink, and in doing so allows the board assembly to be used as a ground-referenced, low-side power switch. Figure 1 shows the top of the DVRFD615X2 150/275 circuit board. The low-level input SMB con- nectors and their associated test points, as well as Vcc and ground test points, appear on the left. The Vcc test point provides power to the IXRFD615X2. The suggested value for Vcc is 12 V. Figure 2 shows the bottom of the board. In the high- power configuration the exposed metallized bottom of the driver is shown. It can be placed in compres- sion against a heat sink or cold plate facilitating the very high power dissipation capabilities of the pack- age. Mounting Orientation As supplied from the factory, the IXRFD615X2 is mounted in the high-power configuration with the metallized substrate tab exposed (Figure 2). Mount- ing holes on either side of the driver and the MOSFETs allow the board to be screwed to a heat sink, clamping the devices to the heat sink and uti- lizing the high-power dissipation capabilities of the device package. A thin coating of thermal compound on the exposed substrate is recommended to pro- vide a better thermal interface between the device and heat sink. Figure 3 depicts the high-power configuration in a end view with the device sandwiched between the printed circuit board and heat sink. When using the circuit board to apply compressive force to the de- vice, care must be taken not to overtighten any mounting screws that could cause the board to flex. Figure 1– DVRFD615X2 150/275 Top Side Figure 2– DVRFD615X2 150/275 Bottom Side Figure 3– View of IXRFD615X2 mounted in a high- power configuration. For additional device installa- tion instructions see technical note “DE–Series MOSFET Mounting & Installation Instructions” avail- able on the IXYSRF website, www.ixyscolorado.com |
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