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DVRFD615X2 데이터시트(PDF) 1 Page - IXYS Corporation

부품명 DVRFD615X2
상세설명  Development Board
PDF  4 Pages
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제조업체  IXYS [IXYS Corporation]
홈페이지  http://www.ixys.com
Logo IXYS - IXYS Corporation

DVRFD615X2 데이터시트(HTML) 1 Page - IXYS Corporation

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DVRFD615X2 Development Board
General Description
The DVRFD615X2 development board is a general-
purpose circuit board designed to simplify the evalu-
ation of the IXRFD615X2 gate driver and provide a
building block for power circuit development. The
IXRFD615X2 gate driver is factory installed on the
evaluation board and is fully tested. The
DVRFD615X2 150/275 configuration enables the
user to drive DE150- or DE275-sized MOSFETs
with their lower drive requirements. The board de-
sign allows both the driver and MOSFETs to be at-
tached to a heat sink, and in doing so allows the
board assembly to be used as a ground-referenced,
low-side power switch.
Figure 1 shows the top of the DVRFD615X2
150/275 circuit board. The low-level input SMB con-
nectors and their associated test points, as well as
Vcc and ground test points, appear on the left. The
Vcc test point provides power to the IXRFD615X2.
The suggested value for Vcc is 12 V.
Figure 2 shows the bottom of the board. In the high-
power configuration the exposed metallized bottom
of the driver is shown. It can be placed in compres-
sion against a heat sink or cold plate facilitating the
very high power dissipation capabilities of the pack-
age.
Mounting Orientation
As supplied from the factory, the IXRFD615X2 is
mounted in the high-power configuration with the
metallized substrate tab exposed (Figure 2). Mount-
ing holes on either side of the driver and the
MOSFETs allow the board to be screwed to a heat
sink, clamping the devices to the heat sink and uti-
lizing the high-power dissipation capabilities of the
device package. A thin coating of thermal compound
on the exposed substrate is recommended to pro-
vide a better thermal interface between the device
and heat sink.
Figure 3 depicts the high-power configuration in a
end view with the device sandwiched between the
printed circuit board and heat sink. When using the
circuit board to apply compressive force to the de-
vice, care must be taken not to overtighten any
mounting screws that could cause the board to flex.
Figure 1– DVRFD615X2 150/275 Top Side
Figure 2– DVRFD615X2 150/275 Bottom Side
Figure 3– View of IXRFD615X2 mounted in a high-
power configuration. For additional device installa-
tion instructions see technical note “DE–Series
MOSFET Mounting & Installation Instructions” avail-
able on the IXYSRF website, www.ixyscolorado.com


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