| 전자부품 데이터시트 검색엔진 |
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HSDL-3003 데이터시트(PDF) 13 Page - Agilent(Hewlett-Packard) |
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HSDL-3003 데이터시트(HTML) 13 Page - Agilent(Hewlett-Packard) |
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13 / 21 page ![]() 13 Appendix A: SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil Figure 16. Stencil and PCBA. 1.1 Recommended Land Pattern Figure 17. Land pattern. METAL STENCIL FOR SOLDER PASTE PRINTING LAND PATTERN PCBA STENCIL APERTURE SOLDER MASK 0.60 1.25 1.75 1.35 0.475 1.425 2.375 3.325 CL MOUNTING CENTER SHIELD SOLDER PAD 2.05 0.775 0.10 FIDUCIAL |
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