1Semiconductor

ML7021

22

PACKAGE DIMENSIONS

(Unit : mm)

SSOP28-P-485-0.65-K

Mirror finish

Package material

Lead frame material

Pin treatment

Package weight (g)

Oki Electric Industry Co., Ltd.

Rev. No./Last Revised

Epoxy resin

42 alloy

Solder plating (

≥5 mm)

0.39 TYP.

3/Dec. 5, 1996

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in

storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product

name, package name, pin number, package code and desired mounting conditions (reflow method, temperature

and times).