DAC08

Data Sheet

Rev. D | Page 6 of 21

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

16

15

14

13

12

11

10

9

1

2

3

4

5

6

7

8

V–

(MSB) B1

B2

B3

B4

COMP

V+

B8 (LSB)

B7

B6

B5

DAC08

TOP VIEW

(Not To Scale)

Figure 2. 16-Lead Dual In-Line Package (PDIP and CERDIP)

16

15

14

13

12

11

10

9

1

2

3

4

5

6

7

8

V+

COMP

V–

B8 (LSB)

B7

B6

B5

B4

B3

B2

B1 (MSB)

DAC08

TOP VIEW

(Not To Scale)

Figure 3. 16-Lead Standard Small Outline Package (SOIC_N)

4

5

6

7

8

18

17

16

15

14

20 19

1

2

3

9

10 11 12 13

NC = NO CONNECT

V+

NC

B7

V–

NC

(MSB) B1

B2

B8 (LSB)

DAC08

TOP VIEW

(Not To Scale)

Figure 4. DAC08RC/883 20-Terminal Ceramic Leadless Chip Carrier (LCC)