uS5501

9

uS5501-DS-F0003, Apr. 2012

www.upi-semi.com

Note

1.Package Outline Unit Description:

BSC: Basic. Represents theoretical exact dimension or dimension target

MIN: Minimum dimension specified.

MAX: Maximum dimension specified.

REF: Reference. Represents dimension for reference use only. This value is not a device specification.

TYP. Typical. Provided as a general value. This value is not a device specification.

2.Dimensions in Millimeters.

3.Drawing not to scale.

4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.

SOP-14L Package

Package Information

0.33 - 0.51

8.53 - 8.75

7.62 BSC

0.10 - 0.25

0.19 - 0.25

0.40 - 1.27

1.27 BSC

Recommended Solder Pad Layout

0.70

10

± 0.

1.27

10

± 0.

1.35 - 1.75