DA6510.009

6 September, 2018

4 (32)

ELECTRICAL CHARACTERISTICS

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

Internal regulator voltage

VREG

Temp mode regulator enabled

Note 1.

1.75

1.8

1.9

V

Standby current

All inputs at VDD, no load

Note 2

0.06

0.5

A

Conversion current

consumption

During conversion

Cap. Dif. Reg OFF

Cap. Ratio Reg OFF

Temp Reg ON

VDD Mon. Reg OFF

Note 3

609

565

496

498

1000

950

750

800

A

Average current

consumption

1 conversion/s,

Normal clock (SOSC=00)

Cap. Dif. Reg OFF

OSR=4096

OSR=2048

OSR=1024

OSR=512

OSR=256

50.3

25.3

12.9

6.6

3.5

110

55.5

28.2

14.5

7.68

A

Internal system clock

oscillator frequency

Normal clock (SOSC=00)

Division by 2 (SOSC=01)

Division by 4 (SOSC=10)

Division by 8 (SOSC=11)

TEMPREGEN=0, Note 4

150

200

100

50

25

220

kHz

Normal clock (SOSC=00)

TEMPREGEN=1, Note 4

150

180

210

kHz

Sensor excitation

frequency

MCLK

Normal clock (SOSC=00)

Division by 2 (SOSC=01)

Division by 4 (SOSC=10)

Division by 8 (SOSC=11)

TEMPREGEN=0

37.5

50

25

12.5

6.25

52.5

kHz

Capacitance and VDD

monitoring conversion

time

Normal clock (SOSC=00)

OSR=4096

OSR=2048

OSR=1024

OSR=512

OSR=256

TEMPREGEN=0

82.6

41.6

21.1

10.9

5.8

110

55.5

28.2

14.5

7.68

ms

Temperature conversion

Time

Normal clock (SOSC=00)

OSR=256

TEMPREGEN=1

6.4

7.68

ms

Note 1. Internal regulator must to be enabled only in temperature mode and should be disabled in capacitance and VDD monitoring modes.

Note 2. Leakage current may increase if digital input voltages are not close to VDD (logic level high) or GND (logic level low). Also setting XCS

low activates the EEPROM memory regardless of the XSPI setting and the device consumes 20

A …30A current. To minimize current

consumption XCS should be set low only during time periods when the device is used during SPI communication.