VL53L1 datasheet(31/35 Pages) STMICROELECTRONICS

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VL53L1X

Packaging and labeling

8.5

Pb-free solder reflow process

Table 18 and Figure 24 show the recommended and maximum values for the solder profile.

Customers have to tune the reflow profile depending on the PCB, solder paste, and material

used. We expect customers to follow the recommended reflow profile, which is specifically

tuned for VL53L1X package.

For any reason, if a customer must perform a reflow profile which is different from the

recommended one (especially peak >240 °C), this new profile must be qualified by the

customer at their own risk. In any case, the profile has to be within the “maximum” profile

limit described in Table 18.

Figure 24. Solder profile

Note:

Temperature mentioned in Table 18 is measured at the top of the VL53L1X package.

Note:

The component should be limited to a maximum of three passes through this solder profile.

Table 18. Recommended solder profile

Parameters

Recommended

Maximum

Units

Minimum temperature (TS min)

Maximum temperature (TS max)

Time ts (TS min to TS max)

130

200

90-110

150

200

60 - 120

°C

Temperature (TL)

Time (tL)

Ramp up

217

55-65

217

55 - 65

°C

°C/s

Temperature (Tp-10)

Time (tp)

Ramp up

235

°C

°C/s

Peak temperature (Tp)

240

245

°C

Time to peak

300

Ramp down (peak to TL)-4

-6

°C/s

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