REF3425 datasheet(8/28 Pages) TI1

8 / 28 page

Solder Heat Shift (%)

10%

20%

30%

40%

50%

D017

Temperature (qC)

-55

-35

-15

105

125

2.1

2.15

2.2

2.25

2.3

2.35

2.4

2.45

2.5

2.55

D013

250µs/div

4V/div

15mV/div

VIN

VOUT

(CL = 1µF)

D011

250µs/div

4V/div

5mV/div

VIN

VOUT

(CL = 10µF)

D011

250µs/div

10mA/div

100mV/div

ILOAD

VOUT

+10mA

-10mA

(CL = 1µF, IOUT = 10mA)

D010

250µs/div

10mA/div

20mV/div

ILOAD

VOUT

+10mA

-10mA

+10mA

(CL = 10µF, IOUT = 10mA)

D010

REF3425-EP, REF3430-EP, REF3433-EP, REF3440-EP

SBAS942A – DECEMBER 2018 – REVISED MARCH 2019

www.ti.com

Product Folder Links: REF3425-EP REF3430-EP REF3433-EP REF3440-EP

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Typical Characteristics (continued)

at TA = 25°C, VIN = VEN = 12 V, IL = 0 mA, CL = 10 µF, CIN = 0.1 µF (unless otherwise noted)

Figure 7. Load Transient

Figure 8. Load Transient

Figure 9. Line Transient

Figure 10. Line Transient

Figure 11. Quiescent Current Shutdown Mode

Refer to Solder Heat Shift for more information

Figure 12. Solder Heat Shift Distribution

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