DFG8540/8560

Fully Automatic In-Feed Surface Grinder

Advanced thinning power for large wafers

Grinder of choice

The DFG8540/8560 improves upon the functionality and performance

that made the DISCO 800 series the grinder of choice at facilities

around the world.

Thin grinding (<100 µm)

Advanced handling systems and design features facilitate high yield for

thin wafer grinding.

Design flexibility

The DFG8540/8560 can be integrated with DISCO's Dicing Before

Grinding (DBG) system as well as polishers (DFP8140/8160) for in-line

processing solutions.

Improved grinding quality

Through innovations in equipment design, both spindles now grind wafers at

the same relative position. This improves single wafer thickness variation as

well as wafer to wafer thickness variation.

Backward-compatibility

Supports the same proven technology of DISCO’s 800-series grinding wheels,

spindles, chuck tables and dresser boards.

Handy panel

LCD touch screen

DFG8560

Easy operation

The DFG8540/8560 utilizes an LCD touch

screen graphical user interface, making

operation and maintenance intuitive and

easy.