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BQ27Z561-R1 데이터시트(PDF) 24 Page - Texas Instruments |
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BQ27Z561-R1 데이터시트(HTML) 24 Page - Texas Instruments |
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24 / 26 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 12X ( ) 0.23 (0.5) TYP (0.5) TYP ( ) METAL 0.23 0.05 MAX SOLDER MASK OPENING METAL UNDER SOLDER MASK ( ) SOLDER MASK OPENING 0.23 0.05 MIN 4222640/A 12/2015 DSBGA - 0.4 mm max height YPH0012 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). D SYMM SYMM LAND PATTERN EXAMPLE SCALE:30X 1 2 A B C 3 NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE SOLDER MASK DEFINED |
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