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ACS70331 데이터시트(PDF) 2 Page - Allegro MicroSystems |
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ACS70331 데이터시트(HTML) 2 Page - Allegro MicroSystems |
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2 / 26 page ![]() High Sensitivity, 1 MHz, GMR-Based Current Sensor IC in Space-Saving, Low Resistance QFN and SOIC-8 Packages ACS70331 2 Allegro MicroSystems, LLC 955 Perimeter Road Manchester, NH 03103-3353 U.S.A. www.allegromicro.com SELECTION GUIDE Part Number Current Sensing Range, IPR (A) Sens (Typ) (mV/A) TA (°C) Package Packing [1] ACS70331EESATR-2P5U3 0 to 2.5 800 –40 to 85 12-contact QFN with fused current loop 1500 pieces per reel ACS70331EESATR-2P5B3 ±2.5 400 ACS70331EESATR-005U3 0 to 5 400 ACS70331EESATR-005B3 ±5 200 ACS70331EOLCTR-2P5U3 0 to 2.5 800 –40 to 85 8-lead SOIC 3000 pieces per reel ACS70331EOLCTR-2P5B3 ±2.5 400 ACS70331EOLCTR-005U3 0 to 5 400 ACS70331EOLCTR-005B3 ±5 200 [1] Contact Allegro for additional packing options. ABSOLUTE MAXIMUM RATINGS Characteristic Symbol Notes Rating Units Supply Voltage VCC 7 V Reverse Supply Voltage VRCC –0.1 V Output Voltage VIOUT 6 V Reverse Output Voltage VRIOUT –0.1 V Working Voltage VWORKING Voltage applied between pins 1 to 4 and pins 5 to 12 (QFN) or pins 1 to 4 and pins 5 to 8 (SOIC) 100 V Maximum Continuous Current [2] IP(max) ±10 A Maximum Continuous External Field [3] B ±50 G Nominal Operating Ambient Temperature TA Range E –40 to 85 °C Maximum Junction Temperature [2] TJ(max) 100 °C Storage Temperature Tstg –65 to 125 °C [2] Continuous currents above this may result in changes in performance. See lifetime drift section for sensor drift under different temperature and current conditions. Also, see Thermal Performance and Overcurrent Capability section for allowable constant and transient currents. [3] Continuous magnetic fields above this may result in changes in performance. [4] The ACS70331 should be soldered using Allegro’s recommended soldering profile in (http://www.allegromicro.com/en/Design-Center/Technical-Documents/Semicon- ductor-Packaging-Publications/Soldering-Methods-for-Allegro-Products.aspx). Standard soldering tips will over-stress the device, resulting in shifts in performance. For rework, it is recommended to use hot plates and heat guns/pencils, keeping the temperature of the device below the Maximum Soldering Temperature. |
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