| 전자부품 데이터시트 검색엔진 |
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GD9FS1G8F2ADG 데이터시트(PDF) 50 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD9FS1G8F2ADG 데이터시트(HTML) 50 Page - GigaDevice Semiconductor (Beijing) Inc. |
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50 / 55 page ![]() GD9Fx1GxF2A 50 Dimensions Symbol A A1 b E E1 D D1 e SD SE Unit mm Min - 0.25 0.40 8.90 7.20 BSC 10.90 8.80 BSC 0.80 BSC 1.10 TYP 0.90 TYP Nom - 0.30 0.45 9.00 11.00 Max 1.05 0.35 0.50 9.10 11.10 Note: 1. Controlling dimension: millimeter. 2. Reference document: JEDEC MO-207 3. The diameter of pre-reflow solder ball is ø0.42mm (0.40mm SMO). |
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