MCP1726

DS21936B-page 22

© 2005 Microchip Technology Inc.

8-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated

Exposed Pad Length

Exposed Pad Width

Contact Length

*Controlling Parameter

Contact Width

Drawing No. C04-062

Notes:

Exposed pad dimensions vary with paddle size.

Overall Width

D2

E2

L

b

D

.016

.008

.009

.085

.055

.012

.118 BSC

Number of Pins

Standoff

Contact Thickness

Overall Length

Overall Height

Pitch

p

n

Units

A

A1

E

A3

Dimension Limits

8

.000

.001

.008 REF.

.118 BSC

.031

.026 BSC

MIN

INCHES

NOM

0.40

0.30

3.00 BSC

0.20

.020

.096

.015

.069

0.23

2.15

1.40

0.50

0.37

2.45

1.75

0.02

0.80

3.00 BSC

0.20 REF.

0.65 BSC

MILLIMETERS*

.002

.039

0.00

MIN

MAX

NOM

8

0.05

1.00

MAX

3.

Package may have one or more exposed tie bars at ends.

1.

Pin 1 visual index feature may vary, but must be located within the hatched area.

2.

0.90

.035

(Note 3)

(Note 3)

4. JEDEC equivalent: MO-229

Revised 03/11/05

-

--

-

D2

E

A1 A

A3

TOP VIEW

EXPOSED

METAL

PAD

BOTTOM VIEW

21

ID INDEX

PIN 1

D

L

E2

p

b

n

AREA

(NOTE 2)

TIE BAR

(NOTE 1)

EXPOSED

ALTERNATE EXPOSED

PAD CONFIGURATIONS