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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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MT7697DIN 데이터시트(PDF) 72 Page - List of Unclassifed Manufacturers |
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MT7697DIN 데이터시트(HTML) 72 Page - List of Unclassifed Manufacturers |
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72 / 84 page  MT7697D Internet-of-Things Wireless Connectivity © 2016 MediaTek Inc. Page 72 of 84 This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s). Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited. 4.7 Thermal Characteristics ΘJC assumes that all the heat is dissipated through the top of the package, while ΨJt assumes that the heat is dissipated through the top, sides, and the bottom of the package. Thus it is suggested to use ΨJt to estimate the junction temperature. Table 4-7. Thermal Characteristics Symbol Description Performance Typical Unit TJ Maximum Junction Temperature (Plastic Package) 125 °C ΘJA Junction to ambient temperature thermal resistance[1] 19.21 °C/W ΘJC Junction to case temperature thermal resistance 7.33 °C/W ΨJt Junction to the package thermal resistance[2] 1.65 °C/W Note 1: JEDEC 51-7 system FR4 PCB size: 76.2mm x 114.3mm Note 2: 8mm x 8mm QFN-68 package |
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