TESEO-LIV3R datasheet(26/30 Pages) STMICROELECTRONICS

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Reflow soldering profile

Teseo-LIV3R

26/30

DS12821 Rev 2

Reflow soldering profile

The Teseo-LIV3R is a high temperature strength surface mount GNSS module supplied on

a 18-pin, 6-layer PCB. The final assembly recommended reflow profiles are indicated here

below.

Soldering phase has to be executed with care: in order to avoid undesired melting

phenomenon, particular attention has to be taken on the set up of the peak temperature.

Some suggestions for the temperature profile are reported in the following

recommendations.

Figure 11. Soldering profiles

Table 10. Soldering profile values

Profile feature

PB-free assembly

Average ramp-up rate (TSMAX to Tp)3 °C/sec max

Preheat:

– Temperature min (TSmin)

– Temperature max (TSmax)

– Time (tSmin to tSmax) (tS)

150

°C

200

°C

60-100 sec

Time maintained above:

– Temperature (TL)

– Time (tL)

217

°C

60-70 sec

Peak temperature (TP)

245 +/- 5

°C

Time within 5

°C of actual peak temperature (TP)

10-20 sec

Ramp-down rate

°C/sec

Time from 25 °C to peak temperature

8 minute max.

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