| 전자부품 데이터시트 검색엔진 |
|
ADMV1014ACCZ-R7 데이터시트(PDF) 35 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
ADMV1014ACCZ-R7 데이터시트(HTML) 35 Page - Analog Devices |
|
35 / 42 page ![]() Data Sheet ADMV1014 Rev. A | Page 35 of 42 RECOMMENDED LAND PATTERN Solder the exposed pad on the underside of the ADMV1014 to a low thermal and electrical impedance ground plane. This pad is typically soldered to an exposed opening in the solder mask on the evaluation board. Connect these ground vias to all other ground layers on the evaluation board to maximize heat dissipation from the device package. Figure 122. Evaluation Board Layout for the LGA package EVALUATION BOARD INFORMATION For more information about the ADMV1014 evaluation board, refer to the ADMV1014-EVALZ user guide. |
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |