Data Sheet

HMC798ALC4

Rev. 0 | Page 5 of 26

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

13

1

3

4

2

GND

NIC

NIC

GND

5

6

IF

GND

GND

14 GND

15 LO

16 GND

17 NIC

18 GND

NOTES

1. NOT INTERNALLY CONNECTED. THESE PINS

CAN BE CONNECTED TO RF AND DC GROUND.

PERFORMANCE IS NOT AFFECTED.

2. EXPOSED PAD. THE EXPOSED PAD MUST BE

CONNECTED TO RF AND DC GROUND.

HMC798ALC4

TOP VIEW

(Not to Scale)

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 4, 6, 7, 9, 12,

13, 14, 16,

18, 19, 24

GND

Ground. These pins and package bottom must be connected to RF and dc ground.

2, 3, 10, 17, 20,

21, 22, 23

NIC

Not Internally Connected. These pins can be connected to RF and dc ground. Performance is not affected.

5

IF

Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, dc block

this port externally using a series capacitor of a value chosen to pass the necessary IF frequency range. For

operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction and possible

die failure may result.

8

RF

Radio Frequency Port. This pin is dc-coupled and matched to 50 Ω.

11

Power Supply for the LO Amplifier.

15

LO

Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω.

25

EPAD

Exposed Pad. The exposed pad must be connected to RF and dc ground.

INTERFACE SCHEMATICS

GND

Figure 3. GND Interface Schematic

LO

Figure 4. LO Interface Schematic

IF

Figure 5. IF Interface Schematic

RF

Figure 6. RF Interface Schematic