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FC3470 데이터시트(PDF) 6 Page - First Silicon Co., Ltd

부품명 FC3470
상세설명  Synchronous Buck Converter
PDF  8 Pages
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제조업체  FS [First Silicon Co., Ltd]
홈페이지  http://www.firstsilicon.co.kr/
Logo FS - First Silicon Co., Ltd

FC3470 데이터시트(HTML) 6 Page - First Silicon Co., Ltd

  FC3470 Datasheet HTML 1Page - First Silicon Co., Ltd FC3470 Datasheet HTML 2Page - First Silicon Co., Ltd FC3470 Datasheet HTML 3Page - First Silicon Co., Ltd FC3470 Datasheet HTML 4Page - First Silicon Co., Ltd FC3470 Datasheet HTML 5Page - First Silicon Co., Ltd FC3470 Datasheet HTML 6Page - First Silicon Co., Ltd FC3470 Datasheet HTML 7Page - First Silicon Co., Ltd FC3470 Datasheet HTML 8Page - First Silicon Co., Ltd  
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Where L is the inductor value and RESR is the equivalent series resistance (ESR) value of the output
capacitor. In the case of ceramic capacitors, the impedance at the switching frequency is dominated
by the capacitance. The output voltage ripple is mainly caused by the capacitance. For simplification,
the output voltage ripple can be mated by:
]
[
×
×
×
×
=
IN
OUT
S
OUT
OUT
V
V
C
L
f
V
V
1
8
2
2
In the case of tantalum or electrolytic capacitors, the ESR dominates the impedance at the switching
frequency. For simplification, the output ripple can be approximated to:
IN
OUT
S
OUT
OUT
R
V
V
L
f
V
V
×
]
[
×
×
=
1
The characterics of the output capacitor also affect the stability of the regulation system.
The BC3470 can be optimized for a wide range of capacitance and ESR values.
PCB Layout Guide
PCB layout is very important to achieve stable operation. It is highly recommended to duplicate EVB
layout for optimum performance. If change is necessary,please follow these guidelines and take
for reference.
1) Keep the path of switching current short and minimize the loop area formed by Input capacitor,
high-side MOSFET and low-side MOSFET.
2) Bypass ceramic capacitors are suggested to be put close to the Vin Pin.
3) Ensure all feedback connections are short and direct. Place the feedback resistors and
compensation components as close to the chip as possible.
4) VOUT, LX away from sensitive analog areas such as FB.
5) Connect IN, LX, and especially GND respectively to a large copper area to cool the chip to improve
thermal performance and long-term reliability.
ESR
Function Description(Cont.)
2018. 12. 27
6/8
Revision No : 0
FC3470



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