56F802 Technical Data, Rev. 7

16

Freescale Semiconductor

4. Thermal Characterization Parameter, Psi-JT (

thermocouple on top center of case as defined in JESD51-2.

temperature in steady state customer environments.

5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and

board thermal resistance.

6. See Section 5.1 from more details on thermal design considerations.

7. TJ = Junction Temperature

TA = Ambient Temperature

3.2 DC Electrical Characteristics

Table 3-4 DC Electrical Characteristics

Characteristic

Symbol

Min

Typ

Max

Unit

Input high voltage (XTAL/EXTAL)

2.25

—

2.75

V

Input low voltage (XTAL/EXTAL)

0

—

0.5

V

2.2

—

5.5

V

-0.3

—

0.8

V

Input high voltage (all other digital inputs)

2.0

—

5.5

V

Input low voltage (all other digital inputs)

-0.3

—

0.8

V

-1

—

1

µA

-1

—

1

µA

-1

—

1

µA

-210

—

-50

µA

20

—

180

µA

-1

—

1

µA

Nominal pullup or pulldown resistor value

30

K

Ω

Output tri-state current low

-10

—

10

µA

Output tri-state current high

-10

—

10

µA

-15

—

15

µA