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HRF-ROC093XC
Advance Information
Web Site:
www.mysoiservices.com
Honeywell
Email:
mysoiservices@honeywell.com
Solid State Electronics Center
12001 State Highway 55
2003 09325XC
Published June 2003
Page 3
Plymouth, Minnesota 55441-4799
1-800-323-8295
Typical Application
Package Outline
Need 48 pin package dwg.
Low inductance RF/DC ground connection required below part as bottom ground pad is used for all device grounding.
Additionally, this connection prodvides a direct connection to the die for enhanced thermal dissipation. Package
shown not to scale.
7mm x 7mm
48 pin Leadless
Plastic Chip Carrier
TOP VIEW
HRF-ROC093XC
48
37
1
12
36
25
13
24
HRF ROC093XC
VDD
SPI
Analog Power
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