www.ti.com

EXAMPLE BOARD LAYOUT

12X (0.4)

(R0.05) TYP

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

15X (0.6)

16X (0.2)

(1.6)

(2.4)

(0.7)

UQFN - 0.55 mm max height

RSV0016A

ULTRA THIN QUAD FLATPACK - NO LEAD

4220314/B 05/2019

NOTES: (continued)

3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

SYMM

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 25X

SEE SOLDER MASK

DETAIL

1

4

5

8

9

12

13

16

METAL EDGE

SOLDER MASK

OPENING

EXPOSED METAL

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

EXPOSED

METAL

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DEFINED

SOLDER MASK DETAILS