1. FEATURES

●

Very small conduction losses

●

Negligible switching losses

●

Low forward voltage drop

●

Surface mount device

●

Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

●

We declare that the material of product compliance with

RoHS requirements and Halogen Free.

●

S- prefix for automotive and other applications requiring

unique site and control change requirements; AEC-Q101

qualified and PPAP capable.

2. DEVICE MARKING AND ORDERING INFORMATION

3. MAXIMUM RATINGS(Ta = 25ºC)

Repetitive peak reverse voltage

Continuous forward current

Surge Non repetitive forward current

Power Dissipation

Storage temperature range

Maximum operating junction temperature(Note 1)

Maximum soldering temperature(Note 1)

1. Pulse test: tp = 380 µs,

δ < 2 %

4. THERMAL CHARACTERISTICS

2.On epoxy printed circuit board with recommended pad layout

Parameter

Symbol

Limits

Unit

Thermal resistance from junction to ambient

RθJA

500

℃/W

Tj

150

℃

TL

260

℃

PD

250

mW

Tstg

-55~+150

℃

mA

IFSM

1

A

Parameter

Symbol

Limits

Unit

VRRM

100

V

Schottky Power Rectifier

Device

Marking

Shipping

FDR46

Z46

3000/Tape&Reel

IF

150

SOD-123

1

Cathode

2

Anode

SEMICONDUCTOR

TECHNICAL DATA

FDR46

2019. 06. 12

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Revision No : 0