Data Sheet PU10009EJ01V0DS

13

2SC5509

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions.

For soldering

methods and conditions other than those recommended below, contact your nearby sales office.

Soldering Method

Soldering Conditions

Recommended Condition Symbol

Infrared Reflow

Package peak temperature: 235

°C or below,

Time: 30 seconds or less (at 210

°C or higher),

Count: 2 times or less, Exposure limit: None

Note

IR30-00-2

VPS

Package peak temperature: 215

°C or below,

Time: 40 seconds or less (at 200

°C or higher),

Count: 2 times or less, Exposure limit: None

Note

VP15-00-2

Wave Soldering

Soldering bath temperature: 260

°C or below,

Time: 10 seconds or less,

Count: 1 time, Exposure limit: None

Note

WS60-00-1

Note After opening the dry pack, store it at 25

°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

For the details the recommended soldering conditions, refer to the document SEMICONDUCTOR DEVICE

MOUNTING TECHNOLOGY MANUAL (C10535E: published by NEC Corporation).