DSA1101/21/05/25

DS20005890B-page 12

 2018 Microchip Technology Inc.

6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern

B

A

0.05 C

0.05 C

(DATUM B)

(DATUM A)

C

SEATING

PLANE

1

N

2X

TOP VIEW

SIDE VIEW

NOTE 1

0.10 C

0.08 C

Microchip Technology Drawing C04-1005A Sheet 1 of 2

2X

6X

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

6-Lead Very Thin Dual Flatpack No-Leads (J7A) - 2.5x2.0 mm Body [VDFN]

D

E

A

A1

0.10

C A B

0.05

C

BOTTOM VIEW

12

N

2X b2

4X b1

5X L1

L2

e

2