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LM19-LSI 데이터시트(PDF) 13 Page - Pixart Imaging Inc.

부품명 LM19-LSI
상세설명  Optical Gaming Navigation Chip
PDF  20 Pages
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제조업체  PIXART [Pixart Imaging Inc.]
홈페이지  http://www.pixart.com.tw
Logo PIXART - Pixart Imaging Inc.

LM19-LSI 데이터시트(HTML) 13 Page - Pixart Imaging Inc.

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Version 1.01 | 03 Jan 2019 | 11020AENW
PixArt Imaging Inc. http://www.pixart.com
All rights reserved. Any portion in this paper shall not be reproduced, copied, or transformed to any other forms without permission.
PixArt Imaging Inc.
PMW3389DM Product Datasheet
Optical Gaming Navigation Chip
2.6 PCB Assembly Recommendations
1.
Insert the integrated chip and all other electrical components into PCB.
2.
Wave-solder the entire assembly in a no-wash solder process utilizing solder-fixture. A solder-fixture is required to
protect the chip from flux spray and wave solder paste.
3.
Avoid getting any solder flux onto the chip body as there is potential for flux to seep into the chip package, the solder
fixture should be designed to expose only the chip leads to flux spray & molten solder while shielding the chip body and
optical apertures. The fixture should also set the chip at the correct position and height on the PCB.
4.
Place the lens onto the base plate. Care must be taken to avoid contamination on the optical surfaces.
5.
Remove the protective kapton tapes from optical apertures of the chip. Care must be taken to prevent Contaminants
from entering the apertures. Do not place the PCB with the chip facing up during the entire mouse assembly process.
Hold the PCB vertically when removing kapton tape.
6.
Insert PCB assembly over the lens onto the base plate aligning post to retain PCB assembly. The chip package will self-
align to the lens via the guide posts. The optical position reference for the PCB is set by the base plate and lens. Note
that the PCB motion due to button presses must be minimized to maintain optical alignment.
7.
Recommendation: The lens can be permanently secured to the chip package by melting the lens’ guide posts over the
chip with heat staking process. Please refer to Application Note titled “LM19-LSI Lens: PCB Assembly & Lens Heat Staking
Recommendations” for details and recommendation on the lens heat staking process.
8.
Install mouse top case. There must be a feature in the top case to press down onto the PCB assembly to ensure all
components are stacked or interlocked to the correct vertical height.
9.
Recommended to place mouse feet around the base plate opening to be stabilized on the tracking surface.



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