HMC560ALM3 datasheet(21/22 Pages) AD

21 / 22 page

Data Sheet

HMC560ALM3

Rev. 0 | Page 21 of 22

APPLICATIONS INFORMATION

TYPICAL APPLICATION CIRCUIT

Figure 61 shows the typical application circuit for the

HMC560ALM3. The HMC560ALM3 is a passive device and

does not require any external components. The LO and RF pins

are internally ac-coupled. When IF operation is not required

until dc, it is recommended to use an ac-coupled capacitor at

the IF port.

PACKAGE

BASE

GND

HMC560ALM3

Figure 61. Typical Application Circuit

EVALUATION PCB INFORMATION

The PCB used in this application must use RF circuit design

techniques. Signal lines must have 50 Ω impedance, and the

package ground lead and exposed pad must be connected

directly to the ground planes. The grounded coplanar wave

guide (CPWG) PCB input/output transitions allow the use of

ground signal ground (GSG) probes for testing. The suggested

probe pitch is 400 mm (16 mils). The evaluation circuit board

shown in Figure 62 is available from Analog Devices, Inc., upon

request.

Figure 62. EV1HMC560ALM3 Evaluation PCB

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