STM32MP157C datasheet(164/258 Pages) STMICROELECTRONICS

164 / 258 page

Electrical characteristics

STM32MP157C

164/258

DS12505 Rev 2

Software recommendations

The software flowchart must include the management of runaway conditions such as:

•

Corrupted program counter

•

Unexpected reset

•

Critical Data corruption (control registers...)

Prequalification trials

Most of the common failures (unexpected reset and program counter corruption) can be

reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1

second.

To complete these trials, ESD stress can be applied directly on the device, over the range of

specification values. When unexpected behavior is detected, the software can be hardened

to prevent unrecoverable errors occurring (see application note AN1015 available from the

ST website www.st.com.).

Electromagnetic Interference (EMI)

The electromagnetic field emitted by the device are monitored while a simple application,

executing EEMBC code, is running. This emission test is compliant with SAE IEC61967-2

standard which specifies the test board and the pin loading.

6.3.15

Absolute maximum ratings (electrical sensitivity)

Based on three different tests (ESD, LU) using specific measurement methods, the device is

stressed in order to determine its performance in terms of electrical sensitivity.

Electrostatic discharge (ESD)

Electrostatic discharges (a positive then a negative pulse) are applied to the pins of each

sample according to each pin combination. This test conforms to the ANSI/ESDA/JEDEC

JS-001 and ANSI/ESDA/JEDEC JS-002 standards.

Table 48. EMI characteristics

Symbol Parameter

Conditions

Monitored

frequency band

Max vs.

[fHSE/fCPU]

Unit

8/400 MHz

SEMI

Peak level

VDD = 3.6 V, VDDCORE = 1.2 V, TA = 25 °C,

LFBGA448 package, Fmpuss_ck = 648 MHz,

Fmcu_ck = 209 MHz, M4 core not running,

conforming to IEC61967-2

0.1 to 30 MHz

dBµV

30 to 130 MHz

-2

130 MHz to 1 GHz

1 GHz to 2 GHz

EMI Level

3.5

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