 2017-2018 Microchip Technology Inc.

DS20005745B-page 13

DSC1103/23

6-Lead VDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern

RECOMMENDED LAND PATTERN

Dimension Limits

Units

X1

Contact Pad Width (X4)

Contact Pitch

MILLIMETERS

1.05 BSC

MIN

E

MAX

1.00

Contact Pad Length (X6)

Contact Pad Width (X2)

Y

X2

0.85

Microchip Technology Drawing C04-3007A

NOM

6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]

SILK SCREEN

12

6

C

Contact Pad Spacing

1.60

Space Between Contacts (X4)

G1

0.25

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

C

E

X1

Y

X2

G

0.60