MMBZXAL_SER_2

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 02 — 10 December 2009

7 of 17

NXP Semiconductors

MMBZxAL series

Low capacitance unidirectional double ESD protection diodes

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

[3]

Measured from pin 1 or 2 to pin 3.

Table 9.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per device

thermal resistance from junction

to ambient

in free air

MMBZxAL series

[1] -

-

460

K/W

MMBZ5V6AL

MMBZ6V2AL

MMBZ6V8AL

[2] -

-

420

K/W

MMBZ9V1AL

MMBZ10VAL

MMBZ12VAL

MMBZ15VAL

MMBZ18VAL

MMBZ20VAL

MMBZ27VAL

MMBZ33VAL

[2]

-

-

340

K/W

thermal resistance from junction

to solder point

[3]

MMBZ5V6AL

MMBZ6V2AL

MMBZ6V8AL

-

-

150

K/W

MMBZ9V1AL

MMBZ10VAL

MMBZ12VAL

MMBZ15VAL

MMBZ18VAL

MMBZ20VAL

MMBZ27VAL

MMBZ33VAL

--50

K/W