Nexperia

PUSB3AB4

ESD protection for ultra high-speed interfaces

11. Soldering

SOT1176-1

Remark:

Stencil of 75 m is recommended.

A stencil of 75 m gives an aspect ratio of 0.77

With a stencil of 100 m one will obtain an aspect ratio of 0.58

Footprint information for reflow soldering of DFN2510A-10 package

solder land plus solder paste

occupied area

solder land

solder paste deposit

solder resist

Hx

By

Hy

0.05

C

P

D

0.05

Ay

Dimensions in mm

Ay

By

C

D

Hy

1.25

0.3

0.475

0.2

P

0.5

1.5

Hx

2.45

Generic footprint pattern

Refer to the package outline drawing for actual layout

sot1176-1_fr

Fig. 16. Reflow soldering footprint for DFN2510A-10 (SOT1176-1)

PUSB3AB4

All information provided in this document is subject to legal disclaimers.

Product data sheet

10 October 2019

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