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54HC74 데이터시트(PDF) 3 Page - Silicon Supplies

부품명 54HC74
상세설명  High Speed CMOS Logic
PDF  6 Pages
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제조업체  SS [Silicon Supplies]
홈페이지  https://siliconsupplies.com/
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54HC74 데이터시트(HTML) 3 Page - Silicon Supplies

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High Speed CMOS Logic – 54HC74
Rev 1.0
21/11/17
PARAMETER
SYMBOL
MIN
MAX
UNITS
Supply Voltage
VCC
2.0
6.0
V
DC Input Voltage, Output Voltage
VIN, VOUT
0
VCC
V
Operating Temperature Range
TJ
-55
+125
°C
VCC=2.5V
0
1000
VCC=4.5V
0
500
Input Rise / Fall Time
VCC=6.0V
tr, tf
0
400
ns
Recommended Operating Conditions3 (Voltages referenced to GND)
Absolute Maximum Ratings1
PARAMETER
SYMBOL
VALUE
UNIT
DC Supply Voltage (Referenced to GND)
VCC
-0.5 to +7.0
V
DC Input or Output Voltage (Referenced to GND)
VIN, VOUT
-1.5 to VCC+1.5
V
Storage Temperature Range
TSTG
-65 to 150
°C
Input Current (per Pad)
IIN
±20
mA
Output Current (per Pad)
IOUT
±25
mA
DC Supply Current, VCC or GND, per pad
ICC
±50
mA
Power Dissipation in Still Air
2
PD
750
mW
 
DC Electrical Characteristics (Voltages referenced to GND)
LIMITS
PARAMETER
SYMBOL
VCC
CONDITIONS
25°C
85°C
FULL RANGE
4
UNITS
2.0
1.5
1.5
1.5
4.5
3.15
3.15
3.15
Minimum High-Level
Input Voltage
VIH
6.0
VOUT = 0.1V
or VCC -0.1V
│IOUT│≤ 20µA
4.2
4.2
4.2
V
2.0
0.5
0.5
0.5
4.5
1.35
1.35
1.35
Maximum Low-Level
Input Voltage
VIL
6.0
VOUT = 0.1V
or VCC -0.1V
│IOUT│≤ 20µA
1.8
1.8
1.8
V
2.0
1.9
1.9
1.9
4.5
4.4
4.4
4.4
6.0
VIN = VIH or VIL
│IOUT│≤ 20µA
5.9
5.9
5.9
V
4.5
VIN = VIH or VIL
│IOUT│≤ 4.0mA
3.98
3.84
3.7
V
Minimum High-Level
Output Voltage
VOH
6.0
VIN = VIH or VIL
│IOUT│≤ 5.2mA
5.48
5.34
5.2
V
3.  This device contains protection circuitry against damage due to high static voltages or electric fields. However, precautions must be taken to avoid
applications of voltage higher than max rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to range
GND ≤ (VIN or VOUT) ≤ VCC. Unused inputs must be tied to an appropriate logic voltage level (e.g., GND or VCC). Unused outputs must be left open.
1.  Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods, may
reduce device reliability. 2. Measured in plastic DIP package, results in die form are dependent on die attach and assembly method.



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