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IRFS3607PBF 데이터시트(PDF) 7 Page - Thinki Semiconductor Co., Ltd.

부품명 IRFS3607PBF
상세설명  ThinkiSemi 85V,92A N-Channel Trench Process Power MOSFETs
PDF  7 Pages
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제조업체  THINKISEMI [Thinki Semiconductor Co., Ltd.]
홈페이지  http://www.thinkisemi.com
Logo THINKISEMI - Thinki Semiconductor Co., Ltd.

IRFS3607PBF 데이터시트(HTML) 7 Page - Thinki Semiconductor Co., Ltd.

  IRFS3607PBF Datasheet HTML 1Page - Thinki Semiconductor Co., Ltd. IRFS3607PBF Datasheet HTML 2Page - Thinki Semiconductor Co., Ltd. IRFS3607PBF Datasheet HTML 3Page - Thinki Semiconductor Co., Ltd. IRFS3607PBF Datasheet HTML 4Page - Thinki Semiconductor Co., Ltd. IRFS3607PBF Datasheet HTML 5Page - Thinki Semiconductor Co., Ltd. IRFS3607PBF Datasheet HTML 6Page - Thinki Semiconductor Co., Ltd. IRFS3607PBF Datasheet HTML 7Page - Thinki Semiconductor Co., Ltd.  
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IRFB3607PbF/IRFS3607PbF/IRFSL3607PbF
DIMENSIONS in millimeters and inches
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall
not exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Controlling dimension: inches
(6) Outline conform to JEDEC TO-262 except A1 (maximum), b
(minimum) and D1 (minimum) where dimensions derived the
actual package outline
SYMBOL
MILLIMETERS
INCHES
NOTES
MIN.
MAX.
MIN.
MAX.
A
4.06
4.83
0.160
0.190
A1
2.03
3.02
0.080
0.119
b
0.51
0.99
0.020
0.039
b1
0.51
0.89
0.020
0.035
4
b2
1.14
1.78
0.045
0.070
b3
1.14
1.73
0.045
0.068
4
c
0.38
0.74
0.015
0.029
c1
0.38
0.58
0.015
0.023
4
c2
1.14
1.65
0.045
0.065
D
8.51
9.65
0.335
0.380
2
D1
6.86
8.00
0.270
0.315
3
E
9.65
10.67
0.380
0.420
2, 3
E1
7.90
8.80
0.311
0.346
3
e
2.54 BSC
0.100 BSC
L
13.46
14.10
0.530
0.555
L1
-
1.65
-
0.065
3
L2
3.56
3.71
0.140
0.146
(4)
(4)
Base
metal
Plating
b1, b3
(b, b2)
c1
c
Section B - B and C - C
Scale: None
Section A - A
(3)
E1
(3)
D1
E
B
A
A
A
c2
c
A1
Seating
plane
Lead tip
(3)
(2) (3)
(2)
A
E
(Datum A)
L1
L2
B
B
C
C
3
2
1
L
D
2 x e
3 x b2
3 x b
0.010
A
B
MM
Modified JEDEC outline TO-262
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
TO-262/I2PAK
PACKAGE OUTLINE
© 1995 Thinki Semiconductor Co., Ltd.
http://www.thinkisemi.com.tw/
Page 7/7
Rev.10T



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