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SSM6P35AFE 데이터시트(PDF) 3 Page - Toshiba Semiconductor

부품명 SSM6P35AFE
상세설명  Analog Switches
PDF  8 Pages
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제조업체  TOSHIBA [Toshiba Semiconductor]
홈페이지  http://www.semicon.toshiba.co.jp/eng
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SSM6P35AFE 데이터시트(HTML) 3 Page - Toshiba Semiconductor

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SSM6P35AFE
3
5.
5.
5.
5. Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
5.1.
5.1.
5.1.
5.1. Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, T
Static Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25 
)(Q1, Q2 Common)
)(Q1, Q2 Common)
)(Q1, Q2 Common)
)(Q1, Q2 Common)
Characteristics
Gate leakage current
Drain cut-off current
Drain-source breakdown voltage
Drain-source breakdown voltage
Gate threshold voltage
Drain-source on-resistance
Forward transfer admittance
(Note 1)
(Note 2)
(Note 3)
(Note 3)
Symbol
IGSS
IDSS
V(BR)DSS
V(BR)DSX
Vth
RDS(ON)
|Yfs|
Test Condition
VDS = 0 V, VGS = ±10 V
VDS = -20 V, VGS = 0 V
ID = -1 mA, VGS = 0 V
ID = -1 mA, VGS = 10 V
VDS = -10 V, ID = -100 µA
ID = -10 mA, VGS = -1.2 V
ID = -20 mA, VGS = -1.5 V
ID = -50 mA, VGS = -1.8 V
ID = -150 mA, VGS = -2.5 V
ID = -150 mA, VGS = -4.5 V
VDS = -10 V, ID = -100 mA
Min
-20
-10
-0.3
Typ.
3.2
2.3
2.0
1.5
1.1
430
Max
±1
-1
-1
20
4.0
2.9
2.1
1.4
Unit
µA
V
Ω
mS
Note 1: If a reverse bias is applied between gate and source, this device enters V(BR)DSX mode. Note that the drain-
source breakdown voltage is lowered in this mode.
Note 2: Let Vth be the voltage applied between gate and source that causes the drain current (ID) to below (-100 µA
for this device). Then, for normal switching operation, VGS(ON) must be higher than Vth, and VGS(OFF) must be
lower than Vth. This relationship can be expressed as: VGS(OFF) < Vth < VGS(ON).
Take this into consideration when using the device.
Note 3: Pulse measurement.
5.2.
5.2.
5.2.
5.2. Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, T
Dynamic Characteristics (Unless otherwise specified, Taaaa = 25
= 25
= 25
= 25 
)(Q1, Q2 Common)
)(Q1, Q2 Common)
)(Q1, Q2 Common)
)(Q1, Q2 Common)
Characteristics
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time (rise time)
Switching time (turn-on delay time)
Switching time (fall time)
Switching time (turn-off delay time)
Symbol
Ciss
Crss
Coss
tr
td(on)
tf
td(off)
Test Condition
VDS = -10 V, VGS = 0 V,
f = 1 MHz
VDD = -10 V, ID = -50 mA,
VGS = 0 to -4.5 V, RG = 10 Ω
Duty ≤ 1%, VIN: tr, tf < 5 ns,
Common source, See Chapter 5.3.
Min
Typ.
21
2
6
42
17
145
420
Max
42
Unit
pF
ns
5.3.
5.3.
5.3.
5.3. Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Fig.
Fig.
Fig.
Fig. 5.3.1
5.3.1
5.3.1
5.3.1 Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Fig.
Fig.
Fig.
Fig. 5.3.2
5.3.2
5.3.2
5.3.2 Input Waveform/Output Waveform
Input Waveform/Output Waveform
Input Waveform/Output Waveform
Input Waveform/Output Waveform
2017-06-22
Rev.2.0
©2017 Toshiba Corporation



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