© Koninklijke Philips Electronics N.V. 2005

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights.

Date of release: 15 August 2005

Document number: TDA8777_3

Published in The Netherlands

Philips Semiconductors

TDA8777

Triple 10-bit video DAC, up to 330 MHz sample frequency

21. Contents

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

6

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7

Pinning information . . . . . . . . . . . . . . . . . . . . . . 4

7.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8

Functional description . . . . . . . . . . . . . . . . . . . 5

8.1

Voltage reference . . . . . . . . . . . . . . . . . . . . . . . 5

8.2

Blanking and sync pulse insertion . . . . . . . . . . 6

9

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

10

Thermal characteristics. . . . . . . . . . . . . . . . . . . 7

11

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7

12

Application information. . . . . . . . . . . . . . . . . . 10

13

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12

14

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

14.1

Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

14.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 13

14.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13

14.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14

14.5

Package related soldering information . . . . . . 14

15

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16

16

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17

17

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

18

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

19

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

20

Contact information . . . . . . . . . . . . . . . . . . . . 17