3312 - 2 mm SMD Trimming Potentiometer

3312 - 2 mm SMD Trimming Potentiometer

AVHT Series - High Temperature Automotive Grade Varistors

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

Soldering Recommendations for SMD Components (Continued)

Inspection Criteria

When Wave or Infrared Reflow processes are used, the inspection criteria to determine acceptable solder joints will depend on several

key variables, principally termination material process profiles.

Pb-containing Wave and IR Reflow Soldering

Typical “before” and “after” soldering results for NiSn Barrier Type End Terminations can be seen in Fig. 4. NiSn Barrier Type varistors

form a reliable electrical contact and metallurgical bond between the end terminations and the solder pads. The bond between these two

metallic surfaces is exceptionally strong and has been tested by both vertical pull and lateral (horizontal) push tests. The results exceed

established industry standards for adhesion.

NiSn End Terminations

NiSn End Terminations

Fig. 4 Soldering Criteria for Wave and IR Reflow

Pb-containing Soldering

Fig. 5 Soldering Criteria for Wave and IR Reflow

Pb-free Soldering

NiSn End Terminations

NiSn End Terminations

Fig. 4 Soldering Criteria for Wave and IR Reflow

Pb-containing Soldering

Fig. 5 Soldering Criteria for Wave and IR Reflow

Pb-free Soldering

Pb-free Wave and IR Reflow Soldering

Solder forms a metallurgical junction with the entire volume of the end termination, i.e., it diffuses from pad to end termination across the

inner side, forming a “mirror” or “negative meniscus. The height of the solder penetration can be clearly seen on the end termination and

is always 30 % higher than the chip height.

processes, these varistors are truly considered environmentally friendly.