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9

CRA06P

Vishay Dale

Document Number 31047

Revision 25-Jul-05

For Technical Questions, contact: ff3aresistors@vishay.com

DIMENSIONS

Thick Film, Resistor Array

4-Resistor Device

A

C

w

T

B

P

L

DIMENSIONS [in millimeters]

L

ABC

P

T

W

8

3.20

0.30

0.40

0.40

0.80

0.60

1.6

Tol

± 0.20 ± 0.20 ± 0.15 ± 0.20

-

± 0.10 ± 0.15

SOLDER PAD DIMENSIONS [in millimeters]

cw

p

a

b

WAVE

0.8

2.6

0.8

0.4

0.9

c

b

p

a

w

DESCRIPTION

Production is strictly controlled and follows a set of instructions

established for reproducibility. A thick film layer is deposited

on a high grade ceramic substrate. The resistor elements are

covered by a protective coating designed for electrical,

mechanical and climatic protection. The wrap around

terminations receive a final pure tin on nickel plating.

The result of the determined production is verified by an

extensive testing procedure. Only accepted products are laid

directly into the paper tape in accordance with EIA 481.

ASSEMBLY

The resistors are suitable for processing on automatic SMD

assembly systems. They are suitable for automatic soldering

using wave and solder paste reflow. Due to the design, arrays

have automatic placement capability. The resistors are Lead

(Pb)-free, the pure tin plating provides compatibility with Lead

(Pb)-free and Lead-containing soldering processes. All

products comply with the CEFIC-EECA-EICTA list of legal

restrictions on hazardous substances.

This includes full compatibility with the following directives:

• 2000/53/EC End of Vehicle Life Directive (ELV)

• 2000/53/EC Annex II to End of Vehicle Life Directive (ELV II)

• 2002/95/EC Restriction of the use of Hazardous

Substances Directive (RoHS)

• 2002/96/EC Waste Electrical and Electronic Equipment

Directive (WEEE)

Solderability is specified for 2 years after production or re-

qualification. The permitted storage time is 20 years.

PIN

NO#