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LND01 데이터시트(PDF) 2 Page - Microchip Technology

부품명 LND01
상세설명  Lateral N-Channel Depletion-Mode MOSFET
PDF  12 Pages
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제조업체  MICROCHIP [Microchip Technology]
홈페이지  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

LND01 데이터시트(HTML) 2 Page - Microchip Technology

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LND01
DS20005696A-page 2
 2017 Microchip Technology Inc.
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Drain-to-source Voltage ....................................................................................................................................... BVDSX
Source-to-drain Voltage........................................................................................................................................ BVSDX
Gate-to-source Voltage ............................................................................................................................ –12V to +0.6V
Gate-to-drain Voltage ............................................................................................................................... –12V to +0.6V
Operating Ambient Temperature, TA ................................................................................................... –25°C to +125°C
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: TA = 25°C unless otherwise specified. (Note 1)
Parameter
Sym.
Min.
Typ.
Max.
Unit
Conditions
Drain-to-source Breakdown Voltage
BVDSX
9
—
—
V
VGS = –3V, IDS = 10 µA
Source-to-drain Breakdown Voltage
BVSDX
9
—
—
V
VGD = –3V, ISD = 10 µA
Gate-to-source Off Voltage
VGS(OFF) –0.8
—
–3
V
VDS = 9V, IDS = 1 µA
Source-to-gate Off Voltage
VSG(OFF) –0.8
—
–3
V
VSD = 9V, ISD = 1 µA
Gate-to-source Diode
VGS
–12
—
0.6
V
IGS = ±1 µA
Gate-to-drain Diode
VGD
–12
—
0.6
V
IGD = ±1 µA
Drain-to-source Leakage Current
IDS(OFF)
—
—
1
µA
VGS = –3V, VDS = 9V
Source-to-drain Leakage Current
ISD(OFF)
—
—
1
µA
VGD = –3V, VSD = 9V
Saturated Drain-to-source Current
IDSS
300
—
—
mA
VGS = 0V, VDS = 9V
Saturated Source-to-drain Current
ISDD
300
—
—
mA
VGD = 0V, VSD = 9V
Static Drain-to-source On-state
Resistance
RDS(ON)
—
0.9
1.4
Ω
VGS = 0V, IDS = 100 mA
Static Source-to-drain On-state
Resistance
RSD(ON)
—
0.9
1.4
Ω
VGD = 0V, ISD = 100 mA
Note 1: All DC parameters are 100% tested at 25°C unless otherwise stated.
(Pulse test: 300 µs pulse, 2% duty cycle)
2: Specification is obtained by characterization and is not 100% tested.
AC ELECTRICAL CHARACTERISTICS
Electrical Specifications: TA = 25°C unless otherwise specified. (Note 2)
Parameter
Sym.
Min.
Typ.
Max.
Unit
Conditions
Forward Transconductance
GFS
200
—
—
mmho VDS = 9V, IDS = 50 mA
Input Capacitance
CISS
—
46
—
pF
VGS = –3V, VDS = 5V, 
f = 1 MHz
Common Source Output Capacitance
COSS
—
32
—
pF
Reverse Transfer Capacitance
CRSS
—
23
—
pF
Turn-on Delay Time
td(ON)
—
3.8
—
ns
VDD = 9V, IDS = 100 mA,
RGEN = 25Ω
Rise Time
tr
—
11
—
ns
Turn-off Delay Time
td(OFF)
—
1
—
ns
Fall Time
tf
—
6.4
—
ns
Note 1: All DC parameters are 100% tested at 25°C unless otherwise stated.
(Pulse test: 300 µs pulse, 2% duty cycle)
2: Specification is obtained by characterization and is not 100% tested.



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